Advances in Chemical Mechanical Planarization CMP

Book Advances in Chemical Mechanical Planarization  CMP  Cover

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  • Publisher : Woodhead Publishing
  • Release : 24 September 2021
  • ISBN : 9780128218198
  • Page : 648 pages
  • Rating : 4.5/5 from 103 voters

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Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP

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Advances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP)
  • Author : Suryadevara Babu
  • Publisher : Woodhead Publishing
  • Release Date : 2021-09-24
  • ISBN : 9780128218198
GET THIS BOOKAdvances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric

Advances in CMP Polishing Technologies

Advances in CMP Polishing Technologies
  • Author : Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa
  • Publisher : William Andrew
  • Release Date : 2011-12-06
  • ISBN : 9781437778595
GET THIS BOOKAdvances in CMP Polishing Technologies

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This

Advances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP)
  • Author : Suryadevara Babu
  • Publisher : Woodhead Publishing
  • Release Date : 2016-01-09
  • ISBN : 9780081002186
GET THIS BOOKAdvances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of

Microelectronic Applications of Chemical Mechanical Planarization

Microelectronic Applications of Chemical Mechanical Planarization
  • Author : Yuzhuo Li
  • Publisher : John Wiley & Sons
  • Release Date : 2007-10-19
  • ISBN : 9780471719199
GET THIS BOOKMicroelectronic Applications of Chemical Mechanical Planarization

An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals

Chemical Mechanical Planarization of Microelectronic Materials

Chemical Mechanical Planarization of Microelectronic Materials
  • Author : Joseph M. Steigerwald,Shyam P. Murarka,Ronald J. Gutmann
  • Publisher : John Wiley & Sons
  • Release Date : 2008-09-26
  • ISBN : 9783527617753
GET THIS BOOKChemical Mechanical Planarization of Microelectronic Materials

Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of

Chemical Mechanical Planarization VI

Chemical Mechanical Planarization VI
  • Author : Sudipta Seal
  • Publisher : The Electrochemical Society
  • Release Date : 2003
  • ISBN : 1566774047
GET THIS BOOKChemical Mechanical Planarization VI

Emerging Contaminants

Emerging Contaminants
  • Author : Aurel Nuro
  • Publisher : BoD – Books on Demand
  • Release Date : 2021-05-27
  • ISBN : 9781839624186
GET THIS BOOKEmerging Contaminants

Emerging Contaminants presents the reader with information on classification, recent studies, and adverse effects on the environment and human health of the main classes of contaminants. Emerging contaminants are synthetic or natural compounds and microorganisms produced and used by humans that cause adverse ecological and human health effects when they reach the environment. This book is organized into four sections that cover the classification of contaminants and the instrumental techniques used to quantify them, recent studies on pesticides, antibiotics as

Abrasive Technology

Abrasive Technology
  • Author : Anna Rudawska
  • Publisher : BoD – Books on Demand
  • Release Date : 2018-10-24
  • ISBN : 9781789841930
GET THIS BOOKAbrasive Technology

The subject matter of this book is the information on the abrasive technology methods, the characteristics of the methods (for example, the technological parameters, tools, and machines), innovative methods, characteristics of surface structure and surface properties after this type of mechanical process, and application in various industrial branches and other technical and technological domains. Abrasive technology is very important, for example, in precision component manufacturing and nano-technology devices. The aim of this book is to present information on the characteristics

Advances in Chemical-Mechanical Polishing: Volume 816

Advances in Chemical-Mechanical Polishing: Volume 816
  • Author : Materials Research Society. Meeting
  • Publisher : Unknown
  • Release Date : 2004-09
  • ISBN : UOM:39015059125883
GET THIS BOOKAdvances in Chemical-Mechanical Polishing: Volume 816

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of chemical-mechanical polishing (CMP).

Wafer Manufacturing

Wafer Manufacturing
  • Author : Imin Kao,Chunhui Chung
  • Publisher : John Wiley & Sons
  • Release Date : 2021-01-11
  • ISBN : 9780470061213
GET THIS BOOKWafer Manufacturing

Presenting all the major stages in wafer manufacturing, from crystals to prime wafers. This book first outlines the physics, associated metrology, process modelling and quality requirements and the goes on to discuss wafer forming and wafer surface preparation techniques. The whole is rounded off with a chapter on the research and future challenges in wafer manufacturing.

Advanced Interconnects for ULSI Technology

Advanced Interconnects for ULSI Technology
  • Author : Mikhail Baklanov,Paul S. Ho,Ehrenfried Zschech
  • Publisher : John Wiley & Sons
  • Release Date : 2012-02-17
  • ISBN : 9781119966869
GET THIS BOOKAdvanced Interconnects for ULSI Technology

Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications
  • Author : Yosi Shacham-Diamand,Tetsuya Osaka,Madhav Datta,Takayuki Ohba
  • Publisher : Springer Science & Business Media
  • Release Date : 2009-09-19
  • ISBN : 9780387958682
GET THIS BOOKAdvanced Nanoscale ULSI Interconnects: Fundamentals and Applications

In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation

Springer Handbook of Semiconductor Devices

Springer Handbook of Semiconductor Devices
  • Author : Massimo Rudan,Rossella Brunetti,Susanna Reggiani
  • Publisher : Springer Nature
  • Release Date : 2022-11-10
  • ISBN : 9783030798277
GET THIS BOOKSpringer Handbook of Semiconductor Devices

This Springer Handbook comprehensively covers the topic of semiconductor devices, embracing all aspects from theoretical background to fabrication, modeling, and applications. Nearly 100 leading scientists from industry and academia were selected to write the handbook's chapters, which were conceived for professionals and practitioners, material scientists, physicists and electrical engineers working at universities, industrial R&D, and manufacturers. Starting from the description of the relevant technological aspects and fabrication steps, the handbook proceeds with a section fully devoted to the main conventional

Advances in Abrasive Based Machining and Finishing Processes

Advances in Abrasive Based Machining and Finishing Processes
  • Author : S. Das,G. Kibria,B. Doloi,B. Bhattacharyya
  • Publisher : Springer Nature
  • Release Date : 2020-05-10
  • ISBN : 9783030433123
GET THIS BOOKAdvances in Abrasive Based Machining and Finishing Processes

This book presents the advances in abrasive based machining and finishing in broad sense. Specifically, the book covers the novel machining and finishing strategies implemented in various advanced machining processes for improving machining accuracy and overall quality of the product. This book presents the capability of advanced machining processes using abrasive grain. It also covers ways for enhancing the production rate as well as quality. It fulfills the gap between the production of any complicated components and successful machining with

Through Silicon Vias

Through Silicon Vias
  • Author : Brajesh Kumar Kaushik,Vobulapuram Ramesh Kumar,Manoj Kumar Majumder,Arsalan Alam
  • Publisher : CRC Press
  • Release Date : 2016-11-30
  • ISBN : 9781315351797
GET THIS BOOKThrough Silicon Vias

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT